💼 About This Role

You'll serve as the primary technical partner for customers evaluating thermal interface material products. You'll lead early-to-mid stage customer interactions and ensure successful integration into advanced semiconductor packaging applications. This role offers the chance to work with hyperscalers and ODMs.

🎯 What You'll Do

• Lead design and development for integrating liquid-metal TIM into customer packages.
• Build and test assembly mockups for feasibility and reliability.
• Act as primary technical contact for ODM, OSAT, and hyperscaler teams.
• Prepare technical content like application notes and data reports.

📋 Requirements

• Bachelor's or Master's in Mechanical Engineering, Materials Science, or related field.
• 3–7 years of experience in semiconductor packaging or thermal interface materials.
• Strong understanding of system-level processor packaging/thermal design including TIM selection.
• Proven ability to lead cross-functional technical efforts and deliver customer solutions on time.

✨ Nice to Have

• Experience with elastomeric material design and fabrication.
• Familiarity with thermal test setups, C-SAM, X-ray, or FEA modeling.

🎁 Benefits & Perks

• 🏥 Health, Vision & Dental – 75% coverage for employee and dependents
• 👶 4 weeks Paid Parental and Family Leave
• 🏖️ Unlimited Paid Time Off
• 📅 14 holidays per year