Tech Stack

Description

Join the Starlink team to develop cutting-edge ASICs for space and ground infrastructure, enabling global connectivity. You will lead IC packaging for custom digital beam formers and modems, working with cross-functional teams to optimize performance and drive innovation.

Requirements

• Bachelor's degree in electrical engineering, computer engineering, or physics
• 5+ years experience with IC package design

Responsibilities

• Own and drive advanced package selection and BGA configuration
• Responsible for package/SIP layout, optimization and design verification
• Interface with cross-functional groups on package feasibility and design
• Optimize silicon floor plan, bump and package pin out
• Simulate and optimize signal/power integrity and RF performance