Tech Stack

Description

You will perform detailed root cause failure analysis on microelectronic components and packaging to support high-volume manufacturing, qualification, and field returns, using advanced laboratory tools and physics-of-failure techniques to drive corrective actions that improve the reliability of satellite constellation and user terminals.

Requirements

• Bachelor's degree in materials science, electrical engineering, physics, chemical engineering, or other STEM discipline
• 2+ years of hands-on experience in microelectronics failure analysis or materials characterization (internship applicable)

Responsibilities

• Own end-to-end root cause failure analysis investigations on microelectronics failing in manufacturing, test, and field
• Conduct advanced electrical fault isolation and characterization using techniques like curve trace, TDR, RF characterization, Lock-in Thermography, OBIRCH, EBIRCH, EBAC, and nanoprobing
• Perform advanced physical failure analysis using SEM, FIB, EDS, SAM, cross-sectioning, and related techniques
• Apply physics-of-failure principles to determine root causes of semiconductor failure modes
• Drive corrective actions by working with silicon design, packaging, and manufacturing teams