🛠 Tech Stack

💼 About This Role

You'll shape software for ASM's advanced packaging and hybrid bonding equipment, combining robotics, motion control, and process intelligence. Your work will have immediate impact on complex semiconductor systems. You'll lead architecture and roadmap decisions while growing engineering teams.

🎯 What You'll Do

• Define and own software development plans and roadmaps for advanced packaging solutions
• Lead end-to-end software development with focus on first-time-right quality
• Drive software architecture decisions for long-term business scalability
• Collaborate cross-functionally with process, hardware, and system integration teams

📋 Requirements

• Bachelor's or Master's degree in Computer Science or related field
• Minimum 10 years of experience in software development and baseline management
• Strong hands-on development expertise in C++
• Proven experience with customer-oriented software baseline management and release planning

✨ Nice to Have

• Experience in the semiconductor process equipment industry
• Exposure to advanced packaging process flows such as CoWoS, SoIC, or InFO
• Experience working in fast-paced, customer-driven environments

🎁 Benefits & Perks

• 🌍 Global Impact - Work on technology that enables 5G, AI, and autonomous driving chips
• 🌱 Development Programs - Support for growth and skill advancement
• 🤝 Diverse Culture - Join 4,500+ employees from 70 nationalities
• 💡 Cutting-Edge Innovation - Lead software for hybrid bonding equipment

📨 Hiring Process

Estimated timeline: 3-4 weeks · AI estimate

1. 1Recruiter Call· 30 min
2. 2Technical Interview· 60 min
3. 3System Design Interview· 60 min