Tech Stack

Description

You will architect and optimize the core of our cutting-edge semiconductor products, leading a team of experts in thermo-mechanical design. Your work will establish state-of-the-art simulation methodologies, ensure error-free tape-outs, and drive innovation for our technology roadmap.

Requirements

• MS or PhD in Mechanical Engineering or related field
• 8+ years of domain expertise in Thermal and Mechanical Design including FEA simulation
• 5+ years of experience leading a multi-physics engineering analysis team
• Expertise in advanced package assembly (2.5D, 3D, CPO) and reliability analysis
• Proficiency in SolidWorks, Ansys, or Flotherm and lab-scale validation techniques

Responsibilities

• Lead and manage a cross-disciplinary team of 6-8 engineers in thermal, thermo-mechanical analysis, and mechanical design
• Develop and implement state-of-the-art analysis techniques for photonic/electronic chips and advanced 2.5D/3D CPO packages
• Develop validation techniques and drive data collection for high-confidence analysis outcomes
• Participate in design reviews and publish documents for risk indicators at program milestones
• Manage employee performance, development, and recruiting