🛠 Tech Stack

💼 About This Role

You'll serve as the primary technical partner for customers adopting our thermal interface materials in advanced semiconductor packaging. Working with hyperscalers, ODMs, and OSATs, you'll lead design integration and performance validation for next-gen AI and data center systems. This role offers the chance to solve critical thermal management challenges in a fast-paced startup environment.

🎯 What You'll Do

• Lead design and development of liquid-metal TIM integration into customer packages.
• Build and test assembly mockups for mechanical and reliability validation.
• Act as technical point of contact for ODM, OSAT, and hyperscaler teams.
• Prepare technical content such as application notes and data reports.

📋 Requirements

• Bachelor's or Master's in Mechanical Engineering, Materials Science, or related field.
• 3-7 years of experience in semiconductor packaging or thermal interface materials.
• CAD modeling and hands-on prototyping and testing skills.
• Knowledge of processor packaging thermal design (TIM1/TIM1.5/TIM2) and reliability tests.

✨ Nice to Have

• Experience with design and fabrication of elastomeric materials.
• Familiarity with thermal test setups, C-SAM, X-ray, or FEA modeling.

🎁 Benefits & Perks

• 🏥 Health, Vision & Dental – company pays 75% for employee and dependents.
• 🍼 4 weeks paid parental and family leave.
• 🏖️ Unlimited Paid Time Off.
• 🎉 14 holidays per year.