Tech Stack

Description

You will own packaging assembly processes from concept to mass production, developing new technologies for wafer-level and chip-level systems. You'll select equipment and materials to meet quality, reliability, cost, yield, and production targets, and collaborate cross-functionally to implement advanced packaging solutions for SpaceX's next-generation products.

Requirements

• Bachelor's in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other engineering discipline
• 1+ years with semiconductor packaging processing equipment, silicon, microelectronics, or packaging design (internship applicable)
• Advanced technical degree preferred
• 3+ years industry experience with microelectronics packaging development preferred
• Hands-on packaging, PCB, PCBA, or SMT assembly experience preferred

Responsibilities

• Own packaging assembly processes from concept to mass production
• Develop new technologies for assembly and packaging (wafer grinding, dicing, lithography, etc.)
• Bring-up for new product introduction and new technology introduction
• Select equipment and material to meet quality, reliability, cost, yield, and production targets
• Interface with equipment and material suppliers for continuous improvement