Tech Stack

Description

You will work on leading-edge packaging technologies to enable AI architectures that set new industry standards. As the lead assembly process integrator, you will develop assembly test processes, generate design rules for co-packaged optics, and collaborate with design teams, foundries, and OSAT partners to deliver advanced package designs.

Requirements

• MS or PhD in Mechanical Engineering, Material Science, or related field
• Minimum 10 years' hands-on experience in package assembly and test process development with OSAT providers
• Knowledge of Chip-on-wafer process flow, materials, and equipment requirements
• Experience in test chip and assembly test vehicle design
• Fluent in both English and Mandarin Chinese

Responsibilities

• Develop end-to-end 3D package assembly, test, and fiber-attach processes for Lightmatter products
• Develop package architectures prioritizing DFT, DFM, and DFR to meet performance and cost targets
• Define test chip requirements and manage test chip design for 3D package assembly and test process development
• Develop and validate design rules for high-yielding assembly processes
• Plan and execute design of experiments, manage data, and analyze assembly process and design interactions