🛠 Tech Stack

💼 About This Role

You'll lead the end-to-end design of complex IC substrate packages for high-power AI processors, supporting >700W power delivery and >50GHz high-speed signaling. You'll work with SI/PI teams and OSAT providers to co-optimize CoWoS interposer designs. This role offers the chance to push the limits of AI hardware infrastructure.

🎯 What You'll Do

• Lead IC substrate layout design for high-power AI processors.
• Design >50mm multi-layer packages with dense routing.
• Develop high-speed signal routing solutions beyond 50GHz.
• Optimize CoWoS interposer designs for thermal/electrical performance.

📋 Requirements

• 10+ years of IC substrate layout design for high-performance processors.
• Experience with >50mm large substrate packages and high-density layouts.
• Proven expertise with >700W power delivery network designs.
• Proficiency in Allegro Package Designer for constraint management and routing.

✨ Nice to Have

• Experience with CoWoS interposer design.
• Strong understanding of SI/PI principles.
• Familiarity with design verification (DRC, LVS).

🎁 Benefits & Perks

• 🏥 Medical, dental, and vision packages with generous premium coverage.
• 🏠 Housing subsidy of $2k/month for living within walking distance of office.
• 🚚 Relocation support for moving to San Jose (Santana Row).
• 🍽️ Daily lunch + dinner in office.
• 💪 Wellness benefits covering fitness and mental health.