💼 About This Role

You'll review PEALD SiN gap-fill processes and figure out the mechanism of specific recipes. You'll analyze process parameters to improve gap-fill capability and throughput, then summarize findings with a physical/chemical model. This internship offers hands-on experience with semiconductor process innovation.

🎯 What You'll Do

• Review PEALD SiN gap-fill process and identify recipe mechanisms
• Analyze process sensitivity by single parameter skew
• Evaluate effective deposition parameters for performance improvement
• Propose recipe improvements based on experimental data and models

📋 Requirements

• Enrolled in Materials Engineering, Applied Chemistry, Chemical Engineering, or Electronic Engineering program
• Currently pursuing Master's or Doctoral degree
• Preference for plasma-related experience

✨ Nice to Have

• Simulation capability for mechanism validation
• Knowledge of semiconductor deposition processes

🎁 Benefits & Perks

• 🔬 Hands-on semiconductor R&D experience
• 🌍 Multicultural environment with 70+ nationalities
• 📈 Career growth through development programs

📨 Hiring Process

Estimated timeline: 2-4 weeks · AI estimate

1. 1Online Application· 15 min
2. 2Phone Screen· 30 min
3. 3Technical Interview· 45 min