Description

You will lead the transition of next-generation hardware products from design to mass production, serving as the strategic bridge between Engineering, Product, and Global Supply Chain. You'll ensure revolutionary technology is manufacturable, scalable, and delivered with uncompromising quality to data center partners.

Requirements

• BS in Mechanical, Electrical, or Systems Engineering
• 10+ years experience in Hardware Operations or NPI in semiconductor, networking, or HPC
• Deep understanding of semiconductor fabrication, advanced packaging (2.5D/3D), or optical assembly
• Proven track record managing cross-functional teams and external manufacturing partners
• Experience with silicon photonics, CPO, or advanced packaging preferred

Responsibilities

• Lead cross-functional NPI Core Team to integrate DFM and DFT requirements early in design phase
• Drive Stage-Gate process from Proto to PVT with focus on 3D CPO and laser manufacturing
• Partner with Strategic Sourcing to qualify OSAT partners for Silicon Photonics packaging
• Own ramp-to-volume strategy, identify manufacturing bottlenecks, implement solutions for HVM transition
• Develop and own Master NPI Schedule, proactively identify and mitigate supply chain risks