Description

You will play a key role in advancing ASM's semiconductor process technologies, leveraging your expertise in thin-film deposition and materials characterization to develop innovative solutions for next-generation devices. Your work will directly influence product performance and enable breakthroughs in logic, memory, and power applications.

Requirements

• Master's or PhD in Mechanical or Electrical Engineering preferred
• 10+ years combined education, research, and work experience in thin-film deposition and advanced packaging processes
• At least 5 years experience in semiconductor process engineering or equipment technology
• Proven experience in diagnosing and troubleshooting complex technical issues
• Ability to travel globally up to 50% of the time

Responsibilities

• Research, develop, and optimize semiconductor processes for Advanced Packaging including depositions and surface preparation
• Design and conduct complex experiments using DOE and RSM methodologies; interpret and analyze experimental data
• Troubleshoot equipment issues through hands-on engagement and ensure successful product transfer to customers
• Provide expert technical support for complex electro/mechanical equipment and computer systems
• Assist in customer installations and provide technical training as needed