3h ago

Optical Packaging Engineer

Mountain View, CA

$227,000-$262,000 / year

full-timesenior Hybridsemiconductor

Tech Stack

Description

You will lead the development of next-generation connectivity solutions for Photonic Integrated Circuits (PICs), bridging chip design and high-volume manufacturing. Drive optical architecture from custom lens design through OSAT partner management for mass production.

Requirements

  • BS or MS in Optical Engineering, Physics, Mechanical Engineering, or related field
  • 8-10+ years of hands-on experience in optical or opto-mechanical design in photonics or semiconductor industries
  • Proven track record designing micro-lenses and FAU arrays in Zemax for PIC coupling
  • Hands-on experience with optical alignment and hardware validation
  • Experience managing OSATs and suppliers through full product lifecycle

Responsibilities

  • Lead optical design for PIC-to-PIC and PIC-to-FAU coupling
  • Design and optimize Micro-Lens Arrays (MLAs), FAU arrays, and detachable connectors
  • Drive strategy for sub-micron precision alignment with OSAT partners
  • Establish workflow for Structural, Thermal, and Optical (STOP) analysis
  • Lead technical collaboration with OSATs from prototyping to high-volume production
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