3h ago
Optical Packaging Engineer
Mountain View, CA
$227,000-$262,000 / year
full-timesenior Hybridsemiconductor
Tech Stack
Description
You will lead the development of next-generation connectivity solutions for Photonic Integrated Circuits (PICs), bridging chip design and high-volume manufacturing. Drive optical architecture from custom lens design through OSAT partner management for mass production.
Requirements
- BS or MS in Optical Engineering, Physics, Mechanical Engineering, or related field
- 8-10+ years of hands-on experience in optical or opto-mechanical design in photonics or semiconductor industries
- Proven track record designing micro-lenses and FAU arrays in Zemax for PIC coupling
- Hands-on experience with optical alignment and hardware validation
- Experience managing OSATs and suppliers through full product lifecycle
Responsibilities
- Lead optical design for PIC-to-PIC and PIC-to-FAU coupling
- Design and optimize Micro-Lens Arrays (MLAs), FAU arrays, and detachable connectors
- Drive strategy for sub-micron precision alignment with OSAT partners
- Establish workflow for Structural, Thermal, and Optical (STOP) analysis
- Lead technical collaboration with OSATs from prototyping to high-volume production
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