💼 About This Role

You'll lead chip delivery from design handoff through mass production, serving as the primary technical interface for AI and data center customers. This role combines semiconductor expertise with cross-functional execution to drive on-time, on-spec product execution.

🎯 What You'll Do

• Serve as primary technical interface for key AI and data center customers
• Drive end-to-end product execution for chips, modules, and IP
• Coordinate across design, validation, manufacturing, and supply chain
• Lead development of reusable IP blocks and manage vendor relationships

📋 Requirements

• BSEE required; MSEE or PhD preferred
• 8+ years in semiconductor product development with high-volume delivery
• Experience taking devices through qualification (AEC-Q100, ISO 26262)
• Strong knowledge of semiconductor process technology and advanced packaging

✨ Nice to Have

• Experience with phase-gate project management processes
• Track record of delivering products to Tier-1 hyperscale/cloud customers

🎁 Benefits & Perks

• 🏖️ Unlimited PTO with management approval
• 💰 Competitive salary $185k-$215k
• 🏥 100% employer paid health care including medical, dental, and vision
• 👶 14 weeks paid maternity/paternity at normal pay
• 📈 Early-stage stock options and equity incentives

📨 Hiring Process

Estimated timeline: 2-4 weeks · AI estimate

1. 1Recruiter Screen· 30 min
2. 2Technical Interview· 60 min
3. 3Onsite Interview· Half day