🛠 Tech Stack

💼 About This Role

You'll lead the architecture for how QuantWare's VIO quantum processors are physically realized, pushing high-precision assembly machines beyond their factory specs to handle novel 3D architectures. Your core impact is developing sub-micron placement processes and non-standard 3D integration strategies for quantum devices. This role stands out for its focus on cryogenic-compatible materials and direct collaboration with equipment manufacturers.

🎯 What You'll Do

• Modify high-precision assembly equipment for quantum 3D integration
• Develop sub-micron placement and bonding processes for non-standard substrates
• Design multi-die stacking and interposer-based 3D architectures
• Interface with equipment manufacturers for specialized hardware co-development

📋 Requirements

• BS/MS/PhD in Mechanical Engineering, Mechatronics, Physics, or Materials Science
• 7+ years experience with high-accuracy semiconductor assembly platforms
• <1µm placement accuracy in production or R&D environment
• Deep understanding of 3D integration (TSVs, micro-bumps, interposers)

✨ Nice to Have

• Experience with cryogenic or vacuum-compatible materials
• Knowledge of thermo-compression bonding or laser-assisted bonding

🎁 Benefits & Perks

• 💰 Competitive monthly salary plus 8% annual holiday bonus
• 🏦 Future-proof pension plan (63% premium covered by QuantWare)
• 🏖️ Open vacation policy and flexible hybrid work
• 🚚 Relocation support including visa and temporary housing
• 📚 Personal L&D budget for individual development

📨 Hiring Process

Estimated timeline: 2-4 weeks · AI estimate

1. 1Recruiter screen· 30 min
2. 2Technical interview· 60 min
3. 3On-site/Team fit· 90 min

🚩 Heads Up

• Requirements include both BS/MS/PhD and 7+ years, which may be mismatched