🛠 Tech Stack

💼 About This Role

You'll lead multi-physics modeling and simulation for next-generation AI/HPC advanced packaging systems. Your core impact is driving co-optimization of thermal, mechanical, and electrical interactions across chip, package, and system levels. This role offers the chance to influence real product architecture decisions through simulation-driven insights.

🎯 What You'll Do

• Lead multi-physics modeling across thermal, mechanical, and electrical domains.
• Drive co-optimization of chip, package, and system interactions.
• Develop and validate electro-thermal-mechanical simulation methodologies.
• Perform reliability assessment and root-cause analysis for package failures.

📋 Requirements

• Multi-physics simulation experience with ANSYS, COMSOL, Abaqus, or Icepak.
• Finite element analysis (FEA) expertise for advanced packaging.
• Knowledge of package reliability mechanisms like warpage and solder fatigue.

✨ Nice to Have

• MS or PhD in Mechanical Engineering, Electrical Engineering, or related field.
• Familiarity with advanced packaging designs like CoWoS, EMIB, and 3D stacking.

🎁 Benefits & Perks

• 💰 Competitive salary with equity.
• 🏖️ Flexible PTO policy.
• 🏥 Comprehensive health benefits.
• 📚 Learning and development opportunities.
• 🚀 Work on cutting-edge AI hardware.

📨 Hiring Process

Estimated timeline: 2-4 weeks · AI estimate

1. 1Recruiter Screen· 30 min
2. 2Technical Interview· 60 min
3. 3Onsite Interviews· 4 hours