18h ago

Silicon Photonic Packaging & Process Engineer

New York City

โœจ $135k-$180k / yearest.

full-timesenior Remotemanufacturing

๐Ÿ›  Tech Stack

๐Ÿ’ผ About This Role

You'll lead development and scaling of precision opto-mechanical assembly processes for Voyant Photonics' cutting-edge LiDAR modules. You'll translate R&D builds into repeatable production and partner with contract manufacturers to qualify lines and improve yields. This role offers ownership of critical opto-mechanical and electronic assembly processes that define precision and quality, with opportunity to travel up to 50% globally.

๐ŸŽฏ What You'll Do

  • Define and control automated microlens alignment and bonding processes.
  • Own process parameters for high-precision die-attach and placement equipment.
  • Design and execute structured DOEs to characterize and optimize yield.
  • Lead implementation of robotics and automation for scalable production.

๐Ÿ“‹ Requirements

  • BS/MS in Mechanical, Manufacturing, Photonics, or Electrical Engineering.
  • 5+ years hands-on experience in semiconductor or photonics packaging.
  • Deep familiarity with automated alignment and die-attach systems.
  • Proficiency with DOE methods, SPC, and Minitab.

โœจ Nice to Have

  • Experience with automated micro-optics or fiber alignment processes.
  • Familiarity with ISO 9001 process control or automotive production quality systems.
  • Background in precision metrology systems (e.g., interferometers, confocal profilers).

๐ŸŽ Benefits & Perks

  • ๐Ÿ’ฐ Competitive salary and meaningful equity package
  • ๐Ÿฅ Comprehensive health benefits (Medical, Dental, Vision)
  • ๐Ÿ–๏ธ Unlimited PTO and paid company holidays
  • ๐Ÿฝ๏ธ Complementary lunch provided daily at NYC office

๐Ÿ“จ Hiring Process

Estimated timeline: 2-4 weeks ยท AI estimate

  1. 1Recruiter Screenยท 30 min
  2. 2Technical Interviewยท 60 min
  3. 3Onsite Interviewยท 4 hours

๐Ÿšฉ Heads Up

  • 50% travel requirement may be excessive for some candidates
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