Description

You will lead the development of advanced 3D packaging assembly and test processes for photonics-based AI accelerators, collaborating with foundries and OSAT partners to ensure high yield and reliability.

Requirements

• MS or PhD in Mechanical Engineering, Material Science, or related engineering field.
• 10-12 years of experience in wafer scale packaging assembly process development.
• Knowledge of 2D/3D packaging technologies, materials, and equipment requirements.
• Proven ability to define requirements for test chip and assembly test vehicles.
• Understanding of photonics packaging requirements including various fiber attach methods.

Responsibilities

• Develop end-to-end 3D package assembly, test, and fiber-attach processes for Lightmatter products, ensuring robust high yields while meeting performance and reliability goals.
• Develop and execute package architectures and designs, optimizing for manufacturability and long-term reliability.
• Define test chip requirements and manage test chip design for 3D package process development.
• Develop and validate design rules for high-yielding assembly processes covering assembly/test, backend/RDL, silicon/package interaction, substrate, thermal/mechanical solutions, fiber attach, and system integration.
• Plan and execute design of experiments, manage data, and perform analysis to identify key reliability risks and drive appropriate design and materials solutions.