🛠 Tech Stack

💼 About This Role

You'll translate optical interconnect architectures into scalable, manufacturable hardware at OLIX, focusing on co-packaged optics integration and high-density fiber-optic systems. You'll work hands-on across prototyping, validation, and production ramp to ensure designs are built at scale with high performance and reliability.

🎯 What You'll Do

• Design and optimize high-density fiber-optic and waveguide interconnects
• Develop fiber-to-waveguide and fiber-to-package coupling solutions
• Drive co-packaged optics (CPO) integration at package and system level
• Apply Design for Manufacturing (DFM) principles to optical systems

📋 Requirements

• 5–15 years of experience in advanced micro-fabrication with deep process integration expertise
• Experienced collaborating with external fabs, R&D consortia, or tool vendors
• Proven record creating or modifying complete process flows for novel optoelectronic devices
• B.Eng./M.Sc./Ph.D. in Materials Science, Electrical/Mechanical Engineering, Physics, or related field

✨ Nice to Have

• Familiarity with wafer-level packaging or flip-chip integration
• Experience transferring R&D processes to external pilot or production environments
• Working knowledge of simulation and characterisation (FEM, profilometry, interferometry, L-I-V, or spectral testing)

🎁 Benefits & Perks

• 🏥 Premium Healthcare: Comprehensive BUPA medical and dental cover including MHD
• 🏖️ Time Off: 25 days annual leave plus all UK bank holidays
• 💻 Elite Hardware: M4 Macs as standard, M5 Pro upgrades for engineering team
• 🍽️ Chef-prepared meals for late work
• ☕ Coffee on Us: Tab at local coffee shop

📨 Hiring Process

Estimated timeline: 2-4 weeks · AI estimate

1. 1Recruiter call· 30 min
2. 2Technical interview· 60 min
3. 3On-site interview· 2 hours

🚩 Heads Up

• Due to U.S. export control regulations, eligibility depends on citizenship/permanent residency, restricting applicants from certain countries