🛠 Tech Stack

💼 About This Role

You'll own and drive complex silicon tapeout and advanced packaging programs for a well-funded photonics startup. You'll coordinate cross-functional teams to deliver high-quality silicon on aggressive timelines. This role offers a ground-floor opportunity to shape the optical layer for AI supercomputing.

🎯 What You'll Do

• Plan and execute silicon tapeout and packaging programs
• Partner with engineering leads to prioritize and sequence work
• Create detailed project plans covering scope, schedule, and budget
• Proactively manage risks, issues, and quality
• Facilitate meetings, technical reviews, and operational checkpoints

📋 Requirements

• 10+ years of experience in silicon design and tapeout
• Bachelor's degree in Electrical Engineering or related field
• Solid understanding of silicon tapeout process
• Experience with product bring-up and silicon validation

✨ Nice to Have

• Knowledge of photonic structures and silicon photonics
• Experience with advanced packaging (2.5D/3D, chiplets)
• Startup or new business unit PM framework building experience

🎁 Benefits & Perks

• 🚀 Work at a well-funded startup backed by Mayfield
• 🧠 Collaborate with world-class engineers
• 🌟 Ground-floor opportunity to shape AI infrastructure

📨 Hiring Process

Estimated timeline: 2-4 weeks · AI estimate

1. 1Recruiter Call· 30 min
2. 2Technical Interview· 60 min
3. 3Leadership Interview· 60 min