🛠 Tech Stack

💼 About This Role

You'll develop next-generation semiconductor technologies within ASM's Global R&D Process Engineering Program. After 18-24 months of structured learning, you'll relocate to a permanent R&D role in Japan, Korea, or the US. You'll work hands-on with world-leading processing equipment to drive innovation from lab to fab.

🎯 What You'll Do

• Develop and optimize deposition processes for metal and dielectric films
• Design experiments using DOE and RSM to fulfill project objectives
• Troubleshoot equipment issues through hands-on problem solving
• Produce technical papers and present to professional audiences

📋 Requirements

• PhD degree in Chemical Engineering, Materials Science, Electrical Engineering, or Physics
• 0-7+ years experience with ALD, CVD, Epitaxy, PECVD or other thin film deposition
• Experience with materials characterization techniques like XPS, SIMS, RBS, AFM, XRD
• Knowledge of electrical characterization for CMOS devices

✨ Nice to Have

• Training in CFD (computational fluid dynamics)
• Experience with metal and dielectric films for logic and memory structures

🎁 Benefits & Perks

• 🚀 Accelerated career growth through dedicated R&D program
• 🌍 Global relocation to top R&D centers in Japan, Korea, or US
• 💡 Innovation-driven culture with strong IP portfolio
• 🤝 Collaborative environment with leading scientists and engineers

📨 Hiring Process

Estimated timeline: 2-4 weeks · AI estimate

1. 1Recruiter Screen· 30 min
2. 2Technical Interview· 60 min
3. 3On-site/Hiring Manager· 90 min