Tech Stack

Description

You will lead development, qualification, and implementation of advanced IC packaging solutions for SpaceX's Starlink and Akoustis. Work cross-functionally to deliver optimized semiconductor packaging meeting stringent requirements for high-reliability electronics.

Requirements

• Bachelor's degree in Mechanical, Packaging, Materials, Electrical Engineering or other engineering discipline
• 1+ year experience designing, qualifying, or implementing IC packaging solutions
• 2+ years hands-on experience with semiconductor packaging (preferred)
• Knowledge of assembly processes: SMT, die attach, reflow soldering, underfill
• Experience with EDA/CAD tools such as AutoCAD

Responsibilities

• Design, develop, and qualify IC packaging technologies (flip-chip, wire bonding, WLP, QFN, CSP, LGA)
• Evaluate and select packaging materials based on thermal, mechanical, and electrical properties
• Drive thermal management strategies and reliability test plans for package designs
• Use EDA/CAD tools for mechanical layout; apply DFM methodologies from concept through production
• Conduct failure analysis using X-ray, SEM, FIB, and cross-sectioning