🛠 Tech Stack

💼 About This Role

You'll lead thermal analysis for cutting-edge AI data center photonics products. Your work will enable groundbreaking architectures that set new industry standards in compute power and efficiency. This role offers the chance to solve complex thermal challenges in a fast-growing company backed by $400M in funding.

🎯 What You'll Do

• Perform thermal simulations to influence package and system design.
• Propose novel thermal solutions for product portfolio.
• Develop and validate thermal models for packaging designs.
• Collaborate with design engineers to optimize thermal management.

📋 Requirements

• M.S. or Ph.D. in Mechanical Engineering or related field.
• 5+ years in package or system thermal analysis.
• Deep knowledge of thermal conduction and convective heat transfer.
• Experience with ANSYS Icepak, Fluent, or Flotherm.

✨ Nice to Have

• Knowledge of fluid dynamics and 2D/3D packaging thermal challenges.
• Experience in two-phase immersion cooling and liquid flow.
• Experience in thermal control algorithms and statistical analysis (DOE, JMP).

🎁 Benefits & Perks

• 🏥 Comprehensive Health Care Plan (Medical, Dental, Vision)
• 💰 Retirement Savings Matching Program
• 🏖️ Generous Time Off (Vacation, Sick, Public Holidays)
• 👶 Paid Family Leave
• 🚗 Commuter Benefits

📨 Hiring Process

Estimated timeline: 2-4 weeks · AI estimate

1. 1Recruiter Phone Screen· 30 min
2. 2Technical Interview· 60 min
3. 3Onsite Interviews· 4 hours