Tech Stack

Description

In this role, you will operate and program die bonding equipment for Starlink's IC packaging assembly, develop and optimize bonding recipes, perform inspections using advanced metrology tools, and collaborate with engineers to integrate die bonding into the full packaging flow. Your work directly impacts the quality, reliability, and cost of satellite internet products.

Requirements

• High school diploma or equivalency
• 3+ years hands-on manufacturing experience or bachelor's in engineering, math, or science
• Proficiency with die bonding techniques (conductive adhesives, solder reflow, ultrasonic)
• Familiarity with data analysis and process control tools
• Ability to work shift-based cleanroom, including nights and weekends

Responsibilities

• Operate and program die bonding equipment for micron-level placement
• Develop and optimize bonding recipes for void-free bonds and thermal reliability
• Perform in-process inspections using C-SAM, X-ray, and shear testers
• Troubleshoot process variations and implement corrective actions
• Collaborate with engineers on new product introductions and process qualification