🛠 Tech Stack

💼 About This Role

You'll join the R&D team at Lumilens, developing advanced packaging solutions for high-speed photonic engines powering AI supercomputing. You'll perform FEA simulations to evaluate stress, warpage, and reliability across cutting-edge package architectures. Your work directly impacts the photonics infrastructure that fuels tomorrow's AI infrastructure.

🎯 What You'll Do

• Perform FEA simulations for stress, strain, warpage, and reliability risks.
• Define simulation requirements and deliver design recommendations.
• Lead DOE studies and sensitivity analyses for reliability drivers.
• Collaborate with cross-functional teams to ensure robust package architectures.

📋 Requirements

• BS in Mechanical Engineering with 12+ years FEA experience.
• Deep expertise in advanced packaging technologies (flip-chip, 2.5D/3D integration).
• Proficiency with Ansys Classic/Mechanical and Abaqus.
• Experience calibrating models with empirical data and lab experiments.

✨ Nice to Have

• PhD with 7+ years experience.
• Familiarity with semiconductor packaging processes.
• Strong presentation and technical documentation skills.

🎁 Benefits & Perks

• 🚀 Ground-floor opportunity in photonics infrastructure.
• 🌍 Global collaboration with world-class engineers.
• 💡 Direct impact on next-gen AI supercomputing.
• 🏢 Well-funded startup backed by Mayfield.
• 🛠️ Hands-on work with emerging packaging tech.