🛠 Tech Stack

💼 About This Role

You'll lead thermomechanical characterization and failure analysis for sub-assemblies and silicon dies at PsiQuantum, a leader in silicon photonics quantum computing. Your impact will directly enable debugging complex opto-mechanical failures in first-of-their-kind systems. This role offers a chance to work on building the first useful quantum computers leveraging advanced semiconductor manufacturing.

🎯 What You'll Do

• Perform thermomechanical characterization of sub-assemblies.
• Conduct root cause analysis using fishbone, hypothesis tables, and 8D.
• Execute failure mode and effects analysis (FMEA).
• Utilize Python, MATLAB, and JMP for data processing.

📋 Requirements

• Master's degree or higher in Electrical Engineering, Mechanical Engineering, Optical Engineering, or Applied Physics
• 10+ years of experience in debugging complex failure analysis in opto-mechanical assembly processes
• Experience with FMEA and root cause analysis tools
• Proficiency in Python, MATLAB, and JMP

✨ Nice to Have

• Exposure to photonics sub-assembly and semiconductor packaging
• Experience with die attach, wire bonding, optical coupling, flip chip, underfill

🎁 Benefits & Perks

• 💰 Equity as part of total compensation package
• 🏥 Health benefits for full-time roles
• 🏖️ Flexible PTO (not specified but typical for tech)

📨 Hiring Process

Estimated timeline: 2-4 weeks · AI estimate

1. 1Recruiter Phone Screen· 30 min
2. 2Technical Interview· 60 min
3. 3Onsite Interviews· 4 hours