Tech Stack

Description

You will lead chip architecture for photonics-based AI data center products, collaborating with external partners and internal teams to drive cutting-edge optical interconnect solutions from concept to production. Your work directly shapes the future of high-performance computing.

Requirements

• Ph.D. in Electrical Engineering, Applied Physics, or related field with 10+ years experience and team leadership.
• Deep technical knowledge in photonic/AMS chip co-design.
• Proven success in developing, taping out, and bringing up state-of-the-art photonic/AMS chips and system solutions.
• Proven track record of taking at least two chip architectures from concept to high-volume production.
• Willingness to travel 30% of the time.

Responsibilities

• Guide, coach, and mentor a team of chip architects across photonics, digital, and analog domains.
• Define chip architectures for datacenter/AI compute optical interconnect demonstrations and products.
• Lead co-optimization of SerDes, analog front ends, and optical transceivers for best performance, energy efficiency, and cost.
• Act as primary technical liaison for key customers, partners, and stakeholders regarding chip architecture and roadmap.
• Drive technical selling by articulating competitive advantages and cost benefits to technical and non-technical audiences.