💼 About This Role

You'll serve as the primary technical bridge between major North American chipmakers and overseas R&D teams. As the first local technical hire, you will lead design-in, qualification, and mass production for advanced IC substrate products. This role combines deep packaging expertise with strategic customer-facing impact during a major market expansion.

🎯 What You'll Do

• Serve as technical interface between North American customers and international engineering teams.
• Analyze and resolve complex issues in substrate design, materials, yield, and reliability.
• Lead technical presentations and coordinate data exchange for advanced packaging requirements.

📋 Requirements

• 5+ years experience in IC packaging, substrates, or semiconductor assembly and test.
• Fully bilingual in English and Mandarin for deep technical discussions.
• Deep knowledge of flip chip, chiplets, and 2.5D/3D packaging in an OSAT or foundry environment.

📨 Hiring Process

Talk to Jack AI, then Jill AI evaluates fit and introduces if match.

🚩 Heads Up

• Job posted by AI recruiter with anonymized client information.
• Application process requires talking to an AI before any human contact.