🛠 Tech Stack

💼 About This Role

You'll perform component-level thermal analysis for avionics boards in a LEO satellite constellation, evaluating cooling strategies and thermomechanical risks. Your models will validate against test data to ensure reliability in orbit.

🎯 What You'll Do

• Perform component-level thermal analysis and hot-spot identification.
• Develop thermal models for steady-state and transient conditions.
• Evaluate and recommend cooling strategies for avionics boards.
• Analyze thermomechanical degradation risks like solder fatigue.
• Validate thermal models with empirical measurements and test data.

📋 Requirements

• Bachelor’s or Master’s degree in Mechanical or Aerospace Engineering.
• 3+ years of experience in thermal analysis for electronics or aerospace.
• Proficiency with thermal simulation tools (Ansys IcePak, FloTHERM, or equivalent).
• Strong understanding of heat transfer fundamentals (conduction, convection, radiation).

✨ Nice to Have

• Experience with satellite or spacecraft thermal analysis and orbital environments.
• Background in thermal cycling test planning and simulation-to-test correlation.
• Familiarity with Ansys IcePak specifically.