💼 About This Role

You'll lead back-end fabrication and assembly of quantum processors in a multi-layer chip stack architecture for a cutting-edge quantum computing company. Your work will enable scalable manufacturing of high-performance quantum processors.

🎯 What You'll Do

• Plan and lead back-end fabrication and assembly technology development
• Coordinate integration test plans with cross-functional teams
• Formalize assembly-centric fabrication and process development
• Investigate and resolve integration issues and technical anomalies

📋 Requirements

• 4+ years of experience in chip assembly development of deep-tech or low-volume technology
• Hands-on experience with UBM, hard-stops, bumps, detachable contacts / MEMS, flip-chip technologies
• Background in physics, microwave/RF/electrical engineering or related field

✨ Nice to Have

• Experience with superconducting qubits
• PhD in a relevant field

🎁 Benefits & Perks

• 💰 Competitive monthly salary with 8% annual holiday bonus
• 🏦 Pension plan with 63% employer contribution
• 🏖️ Flexible vacation policy and hybrid work
• ✈️ Relocation support including visa and temporary housing

📨 Hiring Process

Estimated timeline: 2-4 weeks · AI estimate

1. 1Recruiter Screen· 30 min
2. 2Technical Interview· 60 min
3. 3Team Interview· 60 min

🚩 Heads Up

• Requires 4+ years but only says '4+ years' not a clear maximum, may expect seniority beyond listed level
• Mentions 'PhD is a plus' but role requires 4+ years experience, possibly overqualified candidates