AttoTude

You'll lead **silicon wafer fabrication and interposer process** development for **AI datacenter hardware** at a THz interconnect startup. Your core impact is industrializing novel wafer-level processes from concept to high-volume production.

You'll lead **manufacturing process development and scale-up** for **SMT, system-level assembly, and silicon interposer fabrication** at AttoTude, a company pioneering THz interconnect technology for AI data centers. Your work will directly impact high-volume production of next-generation datacenter hardware.

You'll design cutting-edge **advanced packaging solutions** for high-speed interconnects and multichip modules. Your work will drive **product development from concept through volume production** in a rapidly evolving technical environment.

You'll support engineers in testing and characterizing high-speed mixed-signal **ICs for next-generation modem technology**. You'll operate probe stations from DC to THz frequencies for **rapid data collection** in a fast-paced, agile environment. This role offers the chance to work on **cutting-edge intra-DCI applications**.

You'll design, develop, and optimize embedded software for our **next-generation products**. Your work will involve low-level programming, hardware bring-up, and cross-functional collaboration to deliver robust firmware solutions. This role offers the chance to work on cutting-edge technology in a dynamic environment.

You'll lead the design and development of **mixed-signal ICs** for cutting-edge **AI and cloud computing** systems. Your core impact will be driving high-speed interconnect design including PAM4 SerDes up to 112Gbps. This hands-on role offers the chance to own the full design cycle from concept to production.

You'll lead the development and scale-up of novel manufacturing processes for **specialty THz wires**, **precision alignment**, and connectors at AttoTude. Your work will directly impact the high-volume production of next-generation datacenter hardware.

You'll architect **high-speed digital and analog circuits** for next-generation semiconductor technologies, enabling THz interconnects for AI data centers. Your work will directly **eliminate networking bottlenecks** and unlock the full potential of artificial intelligence. Collaborate with cross-functional R&D teams to translate concepts into scalable solutions.

You'll contribute to developing THz modems for intra-DCI applications, working with early prototypes to establish benchmarks. Your experimental data will fuel designs and **optimize overall system performance**. This role requires close collaboration with component designers on **signal processing and performance issues**.

You'll lead **manufacturing process development** for THz wire, connectors, and silicon interposer technologies at a pioneering data center interconnect company. Your core impact is scaling processes from prototype to high-volume production. You'll drive **rapid problem-solving** and **cross-functional collaboration** to meet aggressive timelines.

You'll lead **advanced manufacturing technologies** from development through high-volume production for **AI data center interconnects**. You'll own technical program strategy and serve as the bridge across R&D, wafer fabs, and OSATs. This role combines **wafer-fab technical expertise** with disciplined program leadership.

You'll maintain and operate a **component-level RF/mmWave testbed** for terahertz interconnect technology at a **deep-tech startup**. You will collect and analyze data from DC to 1 THz to guide design decisions. This role offers hands-on experience with cutting-edge technology in a fast-paced startup environment.

You'll lead the design and development of **cutting-edge THz ICs** for AI and hyperscale data center applications. Your work will drive **high-speed interconnects** with 100GHz bandwidth using Si, SiGe, and III-V technologies. This role offers the chance to take ownership of the full design cycle from concept to production.